Hydromel
Structure de mise en forme 2 colonnes

Austria / 440 employees

DATACON Technology AG is a leading global manufacturer of flip chip and multichip die bonding equipment for the semiconductor, telecommunication and automotive industry. The equipment is especially designed for the advanced packaging market and is characterized by a flexible platform, which allows a wide field of applications and as well as customized solutions. Its customers consist primarily of leading U.S., European, Asian, Korean and Japanese semiconductor manufacturers and subcontractors.

Hannes Kostner : hannes.kostner@datacon.at